Qualcomm announced S3 Gen 3 and S5 Gen 3, two new audio chips for wireless headphones. These new sound chips aim to improve the sound quality of more affordable wireless headphones and combine advanced connection features with artificial intelligence-supported sound technologies.
Even cheap wireless headphones will have high sound quality with Qualcomm’s new chips
Qualcomm’s S3 Gen 3 and S5 Gen 3 chips provide stronger and more stable wireless connection by offering Bluetooth 5.4 LE and Auracast support. In this way, users will experience music listening with better sound quality and fewer interruptions. In addition, these new chips block outdoor sounds more effectively with their advanced Active Noise Canceling (ANC) features, allowing you to listen to music in a quieter environment.
S3 Gen 3 is a chip designed for mid-range headphones. It offers users a high-quality audio experience by supporting basic audio technologies such as ANC, aptX Adaptive, aptX Lossless. It also provides clearer sounds thanks to the improved Digital-Analog Converter (DAC).
On the other hand, S5 Gen 3 stands out as a chip designed for higher-end headphones. S5 Gen 3 has more memory and DSP processing power, resulting in improved sound quality and performance. Additionally, it supports cutting-edge connectivity features such as Bluetooth 5.4 LE Audio, Bluetooth Auracast, and Spatial Audio.
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These new audio chips offer a wider range of options to wireless headphone manufacturers and promise users a better music experience, while providing advantages such as longer battery life and improved audio performance. Qualcomm’s S3 Gen 3 and S5 Gen 3 chips aim to usher in a new era in wireless audio technology.
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