Technology company Intel has come to the fore with a remarkable success. The company has launched glass substrates for next-generation advanced packaging, planned for the second half. However, it has become a matter of curiosity what the use of glass is for in new generation processors. Here are the details!
Intel introduced the new generation glass layer!
Constantly on the agenda with the problems in the semiconductor industry IntelThis time, it appears with remarkable success. The company has recently launched a new generation of packaging that will further Moore’s Law. first layer of glass introduced.
Vice President of Intel Babak Sabimade a statement about this innovation. In his statement, he stated that more than ten years of research have been carried out for the glass layer. After these innovations, the glass layer became a matter of curiosity.
Compared to other organic substrates, glass carries higher interconnect density. And also better physical, optical and thermal properties also has. In addition, compared to other layers, glass is more working at high temperatures can withstand the conditions.
Along with all this, the glass layer, 50 percent fewer patterns causes disruption. Normally, the edges of the modern chip have a glass-like structure and consist of organic materials. Thanks to the new generation glass surfaces, Intel not only makes the chips thinner but also makes them thinner. connection density It also increases.
In addition, the improved properties of glass also enable form factor packages with particularly high assembly efficiencies. Company, by 2030 in one package one trillion tensistors aims to present. In addition, this development comes after the company’s $3.5 billion investment in its New Mexico production facility.
So, what do you think about Intel’s glass layer development? Don’t forget to share your opinions with us in the comments section!