MediaTek, which is working to expand its mobile processor portfolio, announced in a press release. Dimensity 1050 chipset introduced. The Dimensity 1050, which is a lower version of the Dimensity 1100 in terms of specifications, is the company’s mmWave and To 5G technologies below 6GHz It is the first processor to have
MediaTek Dimensity 1050 features
The MediaTek Dimensity 1050, produced by TSMC with a 6nm fabrication process, 8 core build owner. While there are two ARM Cortex-A78 performance cores running at 2.5GHz, no information was given about the others. However, according to reliable sources, 6 efficiency cores are also used.
Chipset hosting MediaTek HyperEngine 5.0 technology, which optimizes gaming performance and offers a more immersive experience, ARM Mali-G610 GPU contains it. Moreover hardware accelerated AV1 video decoding, HDR10+ and Dolby Vision with its features Full HD+ with up to 144Hz refresh rate It also supports screens.
MediaTek Dimensity 1050, both mmWave as well as Sub-6GHz 5G connection support smartphone manufacturers can use both technologies. It also offers 3CC in the sub-6GHz (FR1) spectrum and 4CC in the mmWave (FR2) spectrum, providing up to 53 percent faster downlink speeds compared to the LTE + mmWave combination.
It is estimated that the first smartphones powered by Dimensity 1050 with Wi-Fi 6E and 2×2 MIMO antenna support will be released between July and September.
Specifications | MediaTek Dimensity 1050 |
---|---|
CPU | 2x Arm Cortex-A78 @ 2.5GHz 6x efficiency cores (not disclosed) |
GPU | Arm Mali-G610 GPU MediaTek HyperEngine 5.0 |
Screen | FHD+, 144Hz Dolby Vision AV1 video decode HDR10+ |
Memory | LPDDR5 UFS 3.1 |
viewing | MediaTek Imagiq 760 ISP Main camera support up to 108 Megapixels Dual HDR Video Capture |
Modem | Integrated multi-mode 5G/4G modem mmWave + sub-6GHz 5G support 4CC/3CC |
Connection | Bluetooth 5 Wi-Fi 6E 2×2 Beidou III-B1C GNSS support |
Production | 6nm |