Wanting to take its position to the top in the smartphone world, Google is putting the final touches on the expected Pixel series. . The company uses processors it produces itself in its devices. New details continue to emerge about the Tensor G3 that will be used in the anticipated series.
Tensor G3 packaging technology solves the heating problem
According to the statement made by Google, the Pixel 8 and Pixel 8 Pro models will be introduced at the “Made by Google” event in New York on October 4. The technology giant, which uses its own processor in its devices, has prepared closely to avoid some of the problems experienced in previous models.
Google is using a method that it will use for the first time in its processors. Tensor G3 aims to minimize the heating problem experienced in previous processors with its packaging technology. According to the information received, the processor will have FO-WLP technology, which is expected to reduce heat production and increase power efficiency.
Accompanied by previous leaks, the features of the processor have also become clear. Tensor G3, which is expected to power the Pixel 8 and 8 Pro, will offer nine CPU cores (4+4+1) combining Cortex-A510 cores and four Cortex-A715, a single high-performance Cortex-X3 core clocked at 3.0 GHz .
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On the other hand, Tensor G2 phones had 32-bit applications. Google will allow 64-bit applications on its new processor. The Tensor G3 goes for an upgraded version of the seven-core Mali-G710 graphics unit. The processor will use Arm Mali-G715 CPU.
Another striking feature of Tensor G3 was the AV1 encoder. BigWave offers AV1 video decoding up to 4K60. Additionally, the processor will be based on the Samsung Exynos 2300 design, which utilizes the 3nm node and has not yet been introduced.