The race for power in the Android market continues as always. The two major chipset manufacturers in the market, Qualcomm and MediaTek, aim to increase their share in the market and impress users by introducing new products. Now, MediaTek introduced the Dimensity 9300+ processor, its latest high-end processor and the improved version of the Dimensity 9300, at the MediaTek Dimensity Developer Conference (MDDC) 2024. At work MediaTek Dimensity 9300+ features…
MediaTek Dimensity 9300+ offers 10% more performance
Coming as an even more advanced version on top of the AI developments in its previous version, Dimensity 9300+ offers a performance increase of up to 10 percent thanks to MediaTek’s new NeuroPilot Speculative Decoding Acceleration technology.
Featuring TSMC’s third generation 4nm process technology, the new chipset hosts eight cores: 1x 3.4 GHz ARM Cortex-X4, 3x 2.85GHz ARM Cortex-X4, and 4x 2.0GHz Cortex-A720. In addition, the processor, which has a 12-core Arm Immortalis-G720 graphics unit, offers a smooth experience at 60 FPS.
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To deliver more effective performance, MediaTek aims to deliver higher performance and longer battery life even in the most popular games by integrating the latest HyperEngine technologies such as Adaptive Gaming Technology (MAGT).
Among the first devices to be powered by the new processor are the vivo X100s, X100s Pro, which will be introduced on May 13, and the iQOO Neo9s Pro at the end of May.
Here are the features of MediaTek Dimensity 9300+:
| Feature | Explanation |
|---|---|
| Processor | 1 x ARM Cortex-X4 cores up to 3.4GHz + 3 x ARM Cortex-X4 cores up to 2.85GHz + 4 x Cortex-A720 cores up to 2.0GHz |
| cache | 18MB L3+ SLC cache: 29% larger than previous generation |
| GPU | Arm Immortalis-G720 MC12 GPU, 2X MSAA support |
| Artificial intelligence | MediaTek APU 790 (Generative AI), up to 33 billion parameters, Proprietary hardware accelerated memory compression technology, Dimensity AI LoRA Fusion 2.0 technology, up to 10% performance increase |
| Process Technology | TSMC’s third generation 4nm process |
| Screen | Up to WQHD 180Hz and 4K 120Hz |
| Camera | Up to 320MP camera, Imagiq 990 |
| Security | HWRoT, Arm Memory Tagging Extension (MTE) Technology, CC EAL4+ Capable, FIPS 140-3, DRM |
| Communication | Sub-6GHz (FR1), mmWave (FR2), 5G-CA, 4G-CA, 5G FDD/TDD, 4G FDD/TDD, TD-SCDMA, WDCDMA, EDGE, GSM |
| SIM Cards | 5G/4G Dual SIM, SA and NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR FR1 TDD+FDD, DSS, FR1 DL 4CC 4×4 MIMO up to 300 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC 2×2 MIMO, 256QAM NR UL 2CC, R16 UL Development, 256QAM VoNR/EPS fallback |
| Location | GPS L1CA+L5+ L1C, BeiDou B1I+ B1C + B2a +B2b, Glonass L1OF, Galileo E1 + E5a +E5b, QZSS L1CA+ L5, NavIC L5 |
| Wireless Communication | Wi-Fi 7 (a/b/g/n/ac/ax/be) compatible, 2T2R, Bluetooth 5.4 |
| Memory | LPDDR5T memory support up to 9600Mbps, support UFS 4.0 + MCQ |