Huaweiaims to make things easier by using technology. Due to various restrictions, the company is facing a shortage of components. For this, it chooses to use and develop related technologies.
Finally, the company is taking steps to solve the high cost problem caused by the use of silicon. For this, it has announced a patent that includes a chip stacking package and terminal equipment.
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Huawei patents ‘chip stacking package’
USA Due to the restriction, Huawei faced many difficulties. The shortage of essential components, especially smartphone chips, is making it harder. For this, the company is developing new technologies related to the chip.
Huawei on April 5 Chinesepatented a new technology for chip stack packaging and equipment. According to the information, this patent semiconductor belonging to the field of technology. According to the latest information, Huawei wants to meet the power supply demand, as well as reduce the cost of using silicon. For this alsochip stacking package‘ patents the technology.
essential component of any electronic device, chipset is happening. Therefore, the reduction in the cost of the chip stack package is likely to lower the overall cost of the device as well. In the near future, at Huawei’s 2021 annual report conference, head of Huaweito improve the company’s chip performance a multi-core chip He said he could adopt the design.
Also, with space replacement, it can be more competitive using stacking performance. This technology from Huawei becomes the first publicly approved chip stacking technology. In short, by increasing the area, a higher performance can be achieved. This means less processing time. As a result, competitiveness increases even more.
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