Qualcomm introduced several new chipsets at the ongoing Snapdragon Summit 2022 event in Hawaii. Alongside the highly anticipated Snapdragon 8 Gen 2 flagship chipset for smartphones, the company announced the Qualcomm S3 Gen 2 and Qualcomm S5 Gen 2, which stand out for their premium wireless audio hardware.
Qualcomm S5 Gen 2 and S3 Gen 2 features
The new Qualcomm S3 Gen 2 and Qualcomm S5 Gen 2 Audio chips qualify as the predecessors of the Qualcomm S3 and Qualcomm S5, which the company announced at MWC earlier this year. Qualcomm claims that the new audio platforms that support Snapdragon Sound technology and are optimized to work with Snapdragon 8 Gen 2 are the company’s “most advanced Bluetooth audio platform to date.”
Both chipsets feature Snapdragon Sound, spatial audio with dynamic head tracking, enhanced lossless music streaming. Qualcomm also announced that it will introduce a host of new premium features, including 48ms latency between phone and earphones for low-latency gaming.
Another remarkable feature of the new chipsets is that they support the third generation Qualcomm Adaptive Active Noise Cancellation. Dynamic ANC technology in new audio platforms also includes Dynamic Transparency mode with automatic speech detection.
James Chapman, Qualcomm and General Manager of Sound, Music and Wearable Devices, explains the new sound chips as follows:
The next-generation Qualcomm S5 and S3 platforms are designed to deliver ultra-low power performance while delivering the rich features consumers want most. We were the first to introduce Lossless audio over Bluetooth and have continued to do so ever since. We know from our 2022 Sound of Sound consumer survey that more than half of consumers say they will seek support for spatial audio in their next set of wireless headphones. Our new platforms have Snapdragon Sound technologies, dynamic head tracking, lossless audio for the new Bluetooth LE Audio specification, and lower latency.